EAST INDIA : GREATER NOIDA
Solder Paste Printer  Specifications: PCB Size: 50X50mm. (Min.) to 330X250mm (Max.) Printing Speed: 9 Sec. / PC Board in high Speed mode Fiducial Method: Standard Fiducial or pads PCB Transfer Time: 6 Sec. / PC Board Printing Direction: Forward / Backward High Speed Vacuum Cleaner Glue Dispenser  Specifications: PCB Size: 50X50mm. (Min) to 330X250mm (Max.) Nozzle: 3 Types (VS, S, and L) Glue Application Speed: 0.07 Sec / Shot PPCB Transfer Time: 2.4 Sec. / PC Board Glue Dispensing Direction: 90° to 89° (In 1° increments)             Chip Shooter  Specifications: PCB Size: 50X50mm. (Min) to 330X250mm (Max.) Tact Time: 0.075 Sec. Per Piece Feeders: 75 +75 (When using 8mm tape thin parts feeder) PCB Transfer Time: 3.2 Sec. Placement Direction: 0 degree to 359 degree (In 1° increments) Applicable Components: Flat chip components 0603 (0201) to 3216, SOPs (8~28P), QFPs ( 18X18mm max.) with lead pitch 0.5mm or more. Fine Pitch Placer  Specifications: PCB Size: 50X50mm. (Min.) to 510X460mm (Max.) Tact Time: Chip – 0.44 Sec./Comp, 0.53Sec./Comp. = QFP’s Feeders: Tape 60 Max. Tray 80 Max. PCB Transfer Time: 3.0 Sec. Placement Direction: 0 degree to 359 degree Applicable: Comp.: Flat chip components 1005
Reflow Oven  Specifications: Heating Zones: 9 Zones Cooling Zones: 3 Zones Total Heating Length: 2745mm Total Cooling Length: 915mm
Auto - Insertion Line
Jumper & Axial Lead Components Insertion		Jumper & Axial Lead Components     Sequencer
Specifications: Cycle Rate: 32000cph Position system: Insertion Area: 457mm X 457mm Accuracy: ± 0.05mm Repeatability: ± 0.025mm Insertion Head: Z span programmable in ± 0.025mm increments, standard tooling. High Density.   5mm Tooling: 5.00mm ~ 30.48mm Clinch Angle: Adjustable from 45° to 90°.		Specifications: Cycle Rate: 25000 cph Wire Size: 0.38mm to 1.07mm Wire Size: 0.38mm to 1.07mm Tape Capacity: Standard (Bulk) 1828 Mtrs. Components Feeders: 120 no’s
Redial Components Insertion
Specifications: Applicable Components Ceramic Capacitor (Ø 3-11) Electrolytic Capacitor (Ø 3-10) Film Capacitor (W3-12) Redial lead resistors Transistors (T092 type)   Feeders: 62 No’s (5.00mm or 2.5mm) PCB Size: Max. 330mm X 250mm
EAST INDIA : BANGALORE    Solder Paste Printing:    Solder Paste Height Measurement     Intrument  Specifications: Board Handling Min. / Max. Size: 2”X2” (50X50) to 20”X16”(508X406mm) Thickness: 0.015” to 0.500”   Print Parameters Print Area: 18”X16” (457X406mm) (X,Y) Sqeegee Speed: 0.25” to 12” / Sec. (6.35X305mm / Sec.)   Vision Fiducial Method: 2 to 5 model standard Fiducial or pads Fiducial Type: MPM unique high-speed linear system with optics    Specifications: Light Sources: LED, Laser Line generator. CCD Camera: 640 X 480 pixels CCIR Field of View: 3.5 X4.5mm CPU: Intel Pentium 4 Processor, 60Gb HDD, CDRW Display: 14” TFT              Component Placement                 Specifications: PCB Size (W X L): 50X50mm to 510X534mm Feeders: 80 types, Intelligent Feeders PCB Load Time: 4.2 Sec. Throughput: 66000cph Applicable Components: 0402 (01004) to 5.0 X 5.0mm & 0402 (01005) to 7.5 X 7.5mm          Automated Optical Inspection - AOI
Specifications: Mechanical System: PCB Size: 410X390mm (Max.) PCB Inspectable Area: 50X70mm (Min.) to 410X390 (Max.) Board Positioning: Board & Panel Fiducials XY Table: Linear motors & Coders   Vision System Vision System: Vectoral Imaging Video Memory: 32MB Camera: Digital Hitachi CCD Resolution : 1280 X 1024   Average Inspection Speed Inspection time/Comp: 4-20ms Average Inspection: Speed for Solder Paste: 15000 contracts per minute Average Production: 170000 components per hour Type of Components Inspected: 0201 up to exotic
Solder Reflow
Specifications: Heating Zones: 9 Zones Cooling Zones: 3 Zones Total Heating Length: 2745mm Total Cooled Length: 915mm
In-Circuit-Testing (ICT)
Specifications: • 1024 channels with 32 Driver Receiver cards • Vector Processor package • Delta Scan and Framescan Plus Vectorless Test • Cap Scan reversed bus capacitor detection • 5V/45A DUT power supply • Prism-Z DSP Analog measurement system • User Relay Board card and cable • PC Controller, Latest Revision • Z1800 configuration computer • Swing arm with CRT Monitor • Windows 98 based system software • Momentum GUI & Z1800 APG software • Operations, programming and maintenance software • VLSI Template Library • Self Test diagnostics block and software • Programmable Vacuum solenoid • Internal vacuum reservoir

Due to the rapid progress and growth experienced over the years, The East India Company has gradually expanded its manufacturing facility. In 2006, we moved our existing facility to a bigger location on a 80,000-sqft area in Bangalore and Greater Noida. Thus, currently East India Company (EIPTL) has a huge presence with manufacturing facilities in Dehradun, Greater Noida and Bangalore.

We have state-of-the art manufacturing units with advanced technologies which include SMT machines and ICT machines to handle complex assembly processes. Wave Soldering Machines are used to handle high volume production process used for PCB assembling. Our fully automated SMT and Auto Insertion facilities that have been recently installed are specially designed to handle lead-free processes. Our manufacturing facility is also equipped with PCB assembly lines with ESD Protected workshop.

We use latest technologies like Thruhole technology along with Surface Mount technology that helps in quick and efficient mass production of manufacturing components. We also offer advanced testing and rework facilities with products like Tara dyne In-Circuit Tester, Automated Optical Inspection, Solder Paste Height Measurement Instrument with Hakko Rework Station Instrument.